MECHANICAL PROCESSING OF SILICON SUBSTRATE, SURFACE CLEANING WITH ABRASIVE MATERIALS

dc.contributor.authorKhabib Shukurullayevich Abdullayev
dc.date.accessioned2025-12-29T18:16:30Z
dc.date.issued2024-09-30
dc.description.abstractThis paper explores the processing of silicon substrates in microelectronics, specifically mechanical processing, polishing, oxidation, and other treatments, as well as the theoretical modeling of the thermoelectric properties of porous SiNWs.
dc.formatapplication/pdf
dc.identifier.urihttps://webofjournals.com/index.php/4/article/view/2193
dc.identifier.urihttps://asianeducationindex.com/handle/123456789/25290
dc.language.isoeng
dc.publisherWeb of Journals Publishing
dc.relationhttps://webofjournals.com/index.php/4/article/view/2193/2173
dc.rightshttps://creativecommons.org/licenses/by-nc-nd/4.0
dc.sourceWeb of Technology: Multidimensional Research Journal; Vol. 2 No. 9 (2024): WOT; 102-108
dc.source2938-3757
dc.subjectSemiconductor devices, integrated circuits, local diffusion, thermoelectric properties of porous SiNWs, silicon substrate, silicon oxide, doping, polishing, oxidation, photolithography, p-n junctions.
dc.titleMECHANICAL PROCESSING OF SILICON SUBSTRATE, SURFACE CLEANING WITH ABRASIVE MATERIALS
dc.typeinfo:eu-repo/semantics/article
dc.typeinfo:eu-repo/semantics/publishedVersion
dc.typePeer-reviewed Article

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